Automotive HPC Chip Comparison: Comprehensive Guide to High-Performance Computing Chips (Q3/2025)

This interactive comparison table provides an in-depth overview of leading high-performance computing (HPC) chips used in automotive applications. Explore key aspects such as performance (TOPS), process nodes, power consumption, integrated cores (ARM, GPUs, NPUs), accelerators, functional safety levels (ASIL), AEC-Q100 compliance, and automotive brand integrations. Data is sourced from official vendor documentation and industry reports as of September 2025. Use the checkboxes below to customize columns and focus on specific chip vendors like NVIDIA, Mobileye, Qualcomm, and more. This resource is ideal for automotive engineers, developers, and researchers evaluating HPC chips for ADAS, autonomous driving, and infotainment systems.

Key Highlights: Compare performance metrics, safety certifications (ISO 26262 ASIL levels), and integration with automotive brands. All data is up-to-date for 2025 releases.

ChipDRIVE Orin
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EyeQ6 High
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HW4 (FSD Computer)
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Journey 6P
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Shenji NX9031
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Snapdragon Ride Flex
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Turing
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Vendor
General
Process Node8 nm7 nm7 nm (Samsung)7 nm (TSMC)5 nm (TSMC)4 nm7 nm (SMIC)
Performance (TOPS)254 (single SoC); up to 1,000+ in multi-chip34 (INT8 DL TOPS)~200โ€“250 (dual SoC)560 (Nash BPU; L2+ to L4 NOA)~1,000 (equivalent to 4x Orin; single ~250 TOPS)16โ€“24 (single); up to 2,000 in scaled configs750 (single); up to 2,250 in multi-chip (L3/L4)
Power Consumption (Typical)45โ€“60 W (per SoC)~20โ€“30 W (estimated for SoC)~100 W (full system)~35 W (energy-efficient for urban NOA)~40โ€“50 W (estimated; low for EV)30โ€“50 W (per SoC)~30โ€“40 W (estimated; efficient for AI)
Integrated ARM Cores
Arm Cortex A(pplication)A78AE: 12N/ACustom A76/A78: 12โ€“16 (6โ€“8 per SoC)Cortex-A78AE: 18 (410K DMIPS)A78/X1: 32A78: 4Custom A78: 40 (high-performance)
Arm Cortex R(eal-time)R52: 2N/AN/AR52: 4 (ASIL B/D compliance)R5/R52: 2โ€“4 (estimated)R52: 4R52: 4 (estimated; safety-focused)
Arm Mali Cores (GPU)N/AN/AG71: 12 (Bifrost, ~200 GFLOPS, 1 GHz)Mali-G78AE: 3D GPU (visualization)N/AN/AN/A
Integrated Other Cores
Custom Vision ProcessingN/AHigh compute density accelerators: 5 (for Lite); scaled up for HighN/ANash BPU: 4 cores (Transformer-optimized)N/AN/AN/A
AI AcceleratorsN/AN/AN/ABayesian BPU: For NN inferenceN/AHexagon: Included (count proprietary)Integrated NPU: 2 units (30B params)
GPU (Graphics/Compute, Non-Mali)Ampere GPU: 2048 CUDA cores, 64 Tensor coresIntegrated GPU: Details not specifiedN/AN/AProprietary GPU: Supports AI/graphics, details N/AAdreno 663: 8โ€“12 shader cores, 1.5 TFLOPS (Valhall)Proprietary: For end-to-end AI (L4)
Deep Learning Accelerator (DLA/NPU)2 DLAs: For NN inference (up to 70 TOPS combined)CNN Accelerators: Details not specified (vision AI)Custom NPU: 2โ€“3 units (neural nets, ~36 TOPS per NPU)Nash BPU: 560 TOPS (L4 support)Integrated NPU: For Transformer/LiDAR/BEV (6.5x/4x/4.3x boosts)Hexagon NPU: With HVX/HMX (AI/ML focus)DynamAI NN: Up to 30B params (3x Orin equiv.)
Image Signal Processor (ISP)Integrated ISP: For sensor fusionDedicated ISP: For vision tasksIntegrated ISP: 1B pixels/sHigh-res ISP: 16 HD cameras (4K support)Self-developed ISP: 6.5 GP/s pixels, <5ms latencySpectra 690: Multi-camera processingDual ISP: For low-light/edge cases
Other AcceleratorsPVA (Programmable Vision Accelerator): For video encode/decodeCGRA/VLIW/SIMD: Details not specifiedVideo encoders: For camera feedsMulti-sensor fusion: LiDAR/radar/camerasLiDAR/BEV accelerators: 4x/4.3x improvementsEmbedded Vision Accelerator: For ADASCanghai Platform: 33x bandwidth (L4 neural nets)
Safety and Compliance
Functional Safety Grade (ASIL, Random Faults)ASIL B (random hardware faults)ASIL D (random faults for SEooC)ASIL B (estimated; relies on redundancy)ASIL B (random faults; certified)ASIL D (estimated; random faults via redundancies)ASIL D (random faults in safety island)ASIL B (estimated; redundancy for L3/L4)
Functional Safety Grade (ASIL, Systematic Faults)ASIL D (development processes)ASIL D (systematic capability for SEooC)ASIL D (estimated; via rigorous design)ASIL D (systematic; ISO 26262 process)ASIL D (estimated; via automotive-grade design)ASIL D (systematic capability)ASIL D (estimated; end-to-end safety)
AEC-Q100 ComplianceYes (Grade 1, -40ยฐC to 125ยฐC)Yes (Grade 1, automotive-qualified)Yes (Grade 2, -40ยฐC to 105ยฐC)Yes (Grade 1, automotive-qualified; 7nm)Yes (Grade 1, automotive-qualified; 5nm process)Yes (Grade 1, automotive-qualified)Yes (Grade 1, automotive-qualified; 7nm)
Automotive Brand Integrations
NIOET7, ES7, ES8, EC7, ONVO L60N/AN/AN/AET9, ET5, ET5 Touring, ES6, EC6N/AN/A
VolvoEX90, XC90 (next-gen)N/AN/AN/AN/AN/AN/A
Mercedes-BenzEQE, EQS, S-Class (Drive Pilot)EQE updates (via Valeo)N/AN/AN/AN/AN/A
LucidAir (DreamDrive Pro)N/AN/AN/AN/AN/AN/A
BYDHan EV, Tang EVN/AN/AHan, Tang, Seagull, Qin Plus, DolphinN/AN/AN/A
RivianR1T, R1SN/AN/AN/AN/AN/AN/A
XPengG9, P7+N/AN/AN/AN/AN/AP7+, G7, MONA M03
Li AutoL9, L7, L6N/AN/AL9, L7N/AN/AN/A
Jaguar Land RoverElectric Range Rover (next-gen)N/AN/AN/AN/AN/AN/A
ToyotabZ4X (updates)N/AN/AN/AN/AN/AN/A
PolestarPolestar 3, 4N/AN/AN/AN/AN/AN/A
TeslaN/AN/AModel S, Model X, Model 3 Highland, Model Y Juniper, CybertruckN/AN/AN/AN/A
General MotorsN/AN/AN/AN/AN/ACadillac Lyriq, Celestiq (Ultra Cruise)N/A
BMWN/AN/AN/AN/AN/AiX3, i7, 7 SeriesN/A
Volkswagen GroupN/AID.7, Golf, Skoda models, SEAT modelsN/AID seriesN/AID.Buzz, ID.7Mid-class EVs (2026)
Sony-Honda (Afeela)N/AN/AN/AN/AN/AAfeela 1 (sedan)N/A
StellantisN/APeugeot 3008, Citroรซn C5 XN/AN/AN/AJeep Grand Cherokee, Peugeot E-3008N/A
LeapmotorN/AN/AN/AN/AN/AB10N/A
GeelyN/AZeekr 001, EXEED VXN/AN/AN/AN/AN/A
NissanN/AAriya, Rogue (ProPilot upgrades)N/AN/AN/AN/AN/A
FordN/AMustang Mach-E (BlueCruise)N/AN/AN/AN/AN/A
CheryN/AN/AN/ATiggo 8 ProN/AN/AN/A
GACN/AN/AN/AAion Y, Aion LXN/AN/AN/A
SAICN/ARoewe RX5N/ARoewe RX5, IM LS7N/AN/AN/A

Data Accuracy and Disclaimer

All data presented on this page, including information about high-performance computing chips and automotive integrations, has been researched with the highest level of accuracy using authoritative sources, such as official vendor documentation and industry standards, as of September 17, 2025. We strive to ensure the information is current, reliable, and relevant for automotive and embedded systems applications.

However, we do not provide any warranty, express or implied, regarding the accuracy, completeness, or suitability of the information for any particular purpose. The data is subject to change due to evolving technologies, vendor updates, or unforeseen discrepancies. Users are encouraged to verify details with official sources or contact vendors directly for the most up-to-date information before making decisions based on this content.

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